Overview
Microsoft’s Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world’s most complex challenges. We are seeking a Packaging Engineer with a focus on mechanical simulation. This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment. At Microsoft Quantum, we aim to empower science and scientists to solve the world’s biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind’s currently unsolvable problems. For more information about our team, visit https://www.microsoft.com/en-us/quantum . Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond. We are looking for a Packaging Engineer with a focus on mechanical simulation. Responsibilities will include adapting industry standard packaging processes and materials to the unique requirements of quantum devices. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices. To be successful, you will actively work with our globally distributed team to establish common, robust assembly processes and materials.
Responsibilities
ResponsibilitiesThermal, structural, and thermo-mechanical simulations for quantum packaging hardware, including substrates, interposers, chip attach, cryogenic fridge components, and supporting cryogenic structures.
Develop simulations that span hand calculations, reduced-order models, and full finite-element analysis FEA depending on fidelity and program needs.
Structural and thermo-mechanical simulations to assess CTE mismatch, interfacial stress, warpage, and deformation across thermal cycles.
packaging reliability assessments, including risks associated with flip-chip attach, solder joints, substrate bonding, and PCB interfaces.
Generate and maintain reusable simulation templates, material libraries, and modeling workflows to improve consistency and efficiency across the packaging team.
Work in teams or independently as required.
Embody our Culture and Values
Qualifications
QualificationsRequired/Minimum Qualifications- Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 3+ years technical engineering experience- OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND
